Em357 module, The MeshConnect EM357 module also integrates an optional 1MB Flash memory for Over-The-Air program updates, making this device ready for Smart Energy Applications. 4 applications, and the MeshConnect Extended Range module. Digi’s Zigbee compatible module uses a Silicon Labs EM357 SoC with a 32-bit ARM® Cortex® M3 processor. The module’s outstanding 120 dB link budget ensures high quality connections even in such The MeshConnect EM357 Module adds a PA to increase range, provide more reliable transmission, and reduce the number of nodes in a network. UART - Timers. The EM35x integrates hardware support for a packet trace module, which allows robust packet-based debug. Manage, configure and test with Digi XBee Studio to accelerate development. The mini module footprint makes them suitable for a wide range of ZigBee The Module’s outstanding 120dB link budget ensures high quality connections even in such harsh environ- ments. <br> DESCRIPTION The MeshConnectTM EM357 Mini Modules from California Eastern Laboratories (CEL) combine high performance RF solutions with the market's premier ZigBee® stack. The EM357 includes Zigbee software. The module’s outstanding 120 dB link budget ensures high quality connections even in such Oct 22, 2010 · California Eastern Laboratories (CEL) is now shipping its new MeshConnect EM357 module, built on the EM357 integrated circuit (IC) for ZigBee from Ember Corp. The MeshConnect EM357 Module is certified and qualified, enabling customers to accelerate time to market by greatly reducing the design and certification phases of development. . The small module footprint makes it suitable for a wide range of ZigElee applications. This element is a critical component of Ember Desktop, the Ember development environment, and provides advanced network debug capability when used with the Ember Debug Adapter (ISA3). 15. 1 EM3x Module Definitions To accommodate the requirements of the different markets, Telegesis and CEL have developed a series of pin-compatible modules based on the Ember EM341, EM346, EM357, and EM3588 chipsets. The small module footprint makes it suitable for a wide range of ZigElee applications. EM357 system on chips (SoCs) include an ARM® Cortex®-M3 microcontroller, 192 kB of flash, 12 kB of RAM, 0 GPIO and are available in a QFN48 package. - sPI (Master/Slave), TWI. Table 1 defines the Telegesis, CEL, and Silicon Labs part numbers for each module as well as describes the differences (Power Amplifier (PA), Low Noise Amplifier (LNA), and RF Based on the latest Ember EM351 and EM357 single chip Zigbee solution the new long-range modules are footprint compatible with the ETRX351 and ETRX357, thus representing drop-in replacement for all applications where a high link budget is required. Available in low and high output power options (+8dBm and +20dBm), these modules can accommodate variable range and performance requirements. Designed for ZigBee Pro applications, the module runs the full ZigBee Pro software stack and Smart Energy profile, enabling applications such as smart meters, smart grid, building automation, remote control, and HVAC. It is useful for open outdoor applications where the nodes are physically far apart or for indoor areas where the nodes have to operate in a noisy RF environment. The MeshConnect EM357 Module adds a PA to increase range, provide more reliable transmission, and reduce the number of nodes in a network. Oct 22, 2010 · The new EM357 module adds breadth and depth to the expanding family of MeshConnect products, which include the MeshConnect System on Chip IC, the original MeshConnect module for simple 802.
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